Friday, March 11, 2011

STMicroelectronics Drives Power-Package Miniaturization While Exceeding Appliance-Safety Standards

Advanced SMBflat package, 40% thinner and half the PCB space of closest rival SOT-223, takes AC switches, SCRs and Triacs to new levels of performance and safety

Geneva, March 11, 2011 - STMicroelectronics (NYSE: STM), a global leader serving customers across the spectrum of electronics applications and the world’s leading supplier of power semiconductors for equipment such as domestic appliances, lighting and industrial controls, has introduced a new package that will allow the further miniaturization of control modules that must meet strict safety specifications such as IEC 60370 and IEC 60335.

ST is initially using its new three-lead surface-mount package, SMBflat, to house selected products including an AC switch, an SCR (silicon-controlled rectifier) and three types of Triac, which are widely used in circuits such as valve, motor or pump controls, lamp igniters and circuit breakers.
Occupying half the printed-circuit-board (PCB) area of the popular SOT-223, the new package allows ST’s new ACS108 1-Amp AC switch to achieve the highest ever current density - a key figure of merit - for this type of device.